Breaking News | CIEI 2026 Grand Opening! Embracing Innovation, Creating the Future, and Embarking on a New Era of Intelligence

The 2026 Shanghai International Embossed Intelligence Industry Expo (CIEI 2026), themed "Embossed Intelligence: Creating the Future," officially opened at the National Exhibition and Convention Center (Shanghai). Jointly hosted by the China Electromechanical Integration Technology Application Association and Shanghai International Exhibition (Group) Co., Ltd., the expo brings together cutting-edge technologies, leading enterprises, and domestic and international stakeholders to jointly usher in a new chapter in the development of the embossed intelligence industry.

The inaugural event brought together nearly 200 leading companies in the industry.

This year's exhibition attracted nearly 200 leading companies in the industry. Exhibits covered the entire embodied intelligence industry chain—from embodied intelligence entities, sensing systems, decision-making and cognitive systems, and execution systems, to battery energy storage systems, intelligent connected vehicles, and manufacturing equipment, as well as application scenario demonstrations and industry-academia-research-application integration, comprehensively presenting the complete ecosystem of embodied intelligence from technology to implementation.

Leading Exhibitors Gather, Industry Agglomeration Effect Significant

The inaugural CIEI 2026 attracted all the industry's leading companies, including Unitree Robotics, Accelerated Evolution, Leju, Siasun Robot & Automation, Shanghai Humanoid Robotics, SevenTeng, Rokae, Cloud Depth, Hexagon, and Intime Robotics. JD.com's massive exhibition area set a benchmark for embodied robot displays. The Suzhou Embodi Robotics Group, the Shenzhen Robotics Association Group, and the Zibo Group, among other industry clusters, made a collective appearance, showcasing the strong strength of regional industrial clusters.

On the opening day, industry experts delivered keynote speeches and engaged in high-level discussions.

On the first day of the exhibition, the 2026 Embossed Intelligence Industry Ecosystem Conference was grandly held. More than 300 guests, including representatives from government departments, research institutions, industry organizations, overseas industry associations, emoticon robots, and core component companies, attended the opening ceremony of the first Shanghai International Embossed Intelligence Industry Expo.

Qu Daokui, President of the China Association for the Application of Mechatronics Technology, delivered a speech.

Gu Chunting, Vice Chairman of the Shanghai Council for the Promotion of International Trade, delivered a speech.

In the keynote speech session, Academician Chu Junhao of the Chinese Academy of Sciences delivered a keynote speech on "The Intelligent Wave and Multidimensional Perception," Qu Daokui, President of the China Association for the Application of Mechatronics Technology, provided an in-depth analysis of "The Current Status and Trends of Embodied Intelligent Robots," Liu Huicong, Professor and Doctoral Supervisor at Soochow University, shared "Embodied Intelligent Robot Perception Technology," and Huang Dongyan, Chief Scientist of Shenzhen Zhituo Xinyang Technology Co., Ltd., discussed "Constructing a Mental World Model for Intelligent Robots—A New Paradigm of Embodied Intelligence."

In addition, the opening ceremony also included the launch ceremony of the exhibition, the release of information on the group standard for embodied intelligence, the joint release of innovative technologies and new products, and the authoritative release of the "China Embodied Intelligence Industry Development Report (2026)," providing a guide for the development of the industry.

Nearly 120 teams from 60 universities across China competed fiercely in a national-level robotics competition.

The "2026 National Embossed Intelligence Technology Application Competition" was hosted by the Chinese Society for Simulation Studies and organized by the New Industrial Virtual Training Simulation Professional Committee of the Chinese Society for Simulation Studies, the Education and Training Working Committee of the China Association for Mechatronics Technology Application, and Shanghai International Exhibition (Group) Co., Ltd. This national-level competition focused on "Artificial Intelligence + Manufacturing," with four cutting-edge events covering the entire chain from innovative scenarios to model training. Nearly 120 teams from 60 universities nationwide competed.

A rich array of ecosystem activities will be featured, with four thematic forums and six major sections empowering the entire value chain.

The three-day exhibition will be packed with ecosystem activities, forming a comprehensive empowerment system encompassing six major sections: industry conferences, authoritative releases, competitions, technical forums, supply and demand matchmaking, and market activities. Among these, the four thematic forums will serve as the core engine, precisely covering key issues across the entire value chain of the embodied intelligence industry, from application implementation and core components to standards development and talent cultivation.

On the afternoon of July 2nd, the Embodied Intelligence Scenario Application Forum was successfully held, focusing on the ultimate question of "From the Laboratory to All Industries." Led by authoritative institutions such as the China Center for Information Industry Development (CCID) of the Ministry of Industry and Information Technology and the National-Local Jointly Constructed Humanoid Robot Innovation Center, industry leaders such as Siasun Robot & Automation, SevenTeng Robotics, and EightVision Technology gathered to deeply discuss cutting-edge application directions such as industrial embodied intelligent agents, special robots empowering the hazardous chemical industry, and embodied intelligent general-purpose operating systems, directly addressing the real problems of scenario implementation.

In addition, the "Innovation in the Yangtze River Delta" roadshow - Embodied Intelligence Special Session allows high-quality projects to directly face capital.

The excitement doesn't stop today! In the coming days, three national-level robotics competitions and the 2026 Embodied Intelligence Industry Ecosystem Conference will continue to be a major highlight.

The “2026 National Embodied Intelligence Technology Application Competition,” the “2026 Embodied Intelligence Robot Application Scenario Competition,” and the “National College Student Robotics and Algorithm Competition” will kick off tomorrow. These competitions cover multiple aspects, including technology, application scenarios, and algorithms, comprehensively testing the practical capabilities of embodied intelligence technology.

The Embodied Intelligence Key Components Innovation Forum will be held on the morning of July 3rd, directly addressing the industry's "bottleneck" problems. Experts from top universities such as Shanghai Jiao Tong University and Zhejiang University, along with leading industry companies, will discuss in depth key areas such as the localization of high-precision reducers and servo systems, new chain drive technologies, one-stop force control system solutions, and electronic skin, laying a solid foundation for China's embodied intelligence industry. (The agenda can be viewed via a mini-program at the end of the article.)

The Embodied Intelligence Standards System Construction and Collaborative Development Forum will be held on the afternoon of July 3rd, paving the way for large-scale industrial applications. With the support of authoritative institutions such as the China Academy of Information and Communications Technology, the Shanghai Robotics Industry Technology Research Institute, and the National Robotics Testing and Evaluation Center (Headquarters), a joint exploration was held to discuss the construction path of an embodied intelligence standard system. (The agenda can be viewed via a mini-program at the end of the article.)

The Embodied Intelligence Industry-Education Integration and Talent Cultivation Forum was held on the morning of July 4th. Representatives from Tianjin Vocational Technical Normal University, Nanjing Institute of Technology, Jiangsu Huibo Robotics, Zhiyuan Innovation, Tencent Cloud, and other industry-academia-research partners engaged in in-depth dialogues, injecting new momentum into industry talent cultivation and witnessing the rise of a new generation of technological forces. (The agenda can be viewed via a mini-program at the end of the article.)

On the afternoon of July 3rd, the "2026 Global Embodied Intelligence Industry Chain Collaboration and Overseas Matching Conference," hosted by the Foreign Trade Development Bureau of the Ministry of Commerce of the People's Republic of China, organized by Shanghai International Exhibition Management Co., Ltd., and supported by the Shanghai "Belt and Road" Comprehensive Service Center, efficiently reached overseas technology and market resources. Currently, it has collected numerous embodied intelligence robot and supply chain procurement needs from Europe, Southeast Asia, and East Asia in sectors such as power, logistics, healthcare, and urban management. Leaders from overseas robotics associations and business associations in Switzerland, Italy, South Korea, Thailand, and other countries have confirmed their participation in the conference in China. They aim to help Chinese companies efficiently connect with overseas demands and supply chains, facilitate their global expansion and development, and promote practical cooperation in the domestic and international embodied intelligent supply chain. (Agenda available via mini-program at the end of the article)

On July 3rd, the "Iconic Intelligent Data Acquisition Special Session" in the Robotics Buddies Salon will focus on data acquisition and scenario implementation through in-depth interview-style dialogues. (Agenda available via mini-program at the end of the article)

New product launches and project signing ceremonies will be held throughout the event, continuously generating industry buzz.

Five Exhibitions Linked, Connecting Upstream and Downstream of the Industry Chain

CIEI 2026 will be held concurrently with the 2026 China International Mold Technology and Equipment Exhibition, the Shanghai International Processing and Forming Equipment Exhibition, the Shanghai International Heat Treatment Equipment and Technology Exhibition, and the Shanghai International Low-Carbon Smart Mobility Exhibition. This five-exhibition linkage will connect the entire industry chain, from core components, precision manufacturing, processing and forming, and heat treatment processes to end-user applications, creating a platform for exchange and cooperation across the upstream and downstream industry chains.

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The excitement continues! Join us at the National Exhibition and Convention Center (Shanghai) for CIEI 2026 to witness the dawn of embodied intelligence and create the next era of growth!